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Maxim, Transceiver ICs ··· Support Mass Production of Modules for Data Centers and Wireless Access
Heat shielding for the laser using Maxim transceiver chips and TO-CAN optical technology
Maxim Integrated Products Korea announced that it will mass-produce the industry's first SFP28 transceiver integrated circuit (IC) that supports transistor outline (TO)-can.
By using Maxim SFP28 transceivers, module manufacturers for data center and wireless fronthaul applications do not need to install drivers within the Transmit Optical Subassembly (TOSA). This allows them to protect sensitive lasers from heat, simplify the production process, and increase profitability.
Maxim SFP28 transceivers support advanced Digital Eye Tuning capabilities utilizing inexpensive TO-CAN-based optics. By using TO optics and a single transceiver and controller IC, SFP28 modules can be designed simply in the same way as SFP+ modules.
SFP28 optical modules for data center and wireless front-haul applications must support high performance, low power, and a wide temperature operating range at a lower price than existing SFP+ modules. Maxim’s 28.1Gbps low-power transceiver IC, which meets these requirements, features a CDR (Clock and Data Recovery Circuit) and a laser driver in the transmit path, and a high-sensitivity limiting amplifier and a CDR in the receive path.
Andrew Sharath, Director of Business Management at Maxim Integrated, said, “The Maxim SFP28 transceiver, developed with proven 100Gbps technology, enables high-bandwidth interconnection. “Maxim SFP28 ICs, already supplied to customers in mass production, enable cost-effective upgrades for enterprises, hyperscale data centers, and wireless access networks,” he said.
Dale Murray, a senior analyst at Light Counting Market Research, stated, “As the module market moves from 10Gbps to 25Gbps per lane, demand for SFP28 modules is expected to increase significantly over the next five years,” adding, “Maxim will meet this demand by simplifying module design and lowering costs through its newly released transceiver ICs.”
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