마이크로칩 10월
This page was machine-translated and may differ from the original. View original

Linear Launches μModule for Defense, Aerospace, and Heavy Equipment Industries

Preferred source on GooglePublished2016.06.16 19:59
Provided in SnPb (Tin-Lead) BGA package

Linear Technology Korea (CEO Hong Sa-kwak) announced that it has launched more than 53 µModule® (micromodule) products mounted in SnPb BGA packages.

These products are suitable for applications that prefer the use of tin-lead soldering, such as the defense, aerospace, and heavy equipment industries. The µModule point-of-load (PoL) regulator using SnPb BGA packages enables industrial suppliers to simplify PC board assembly.


µModule power products with SnPb BGA packages are available in four DC/DC converter categories:

More than 100 µModule products are available at www.linear.com/umodule in the lead-free (SAC305) version of this device and in both BGA and LGA packages.

Information on SnPb BGA µModule power products can be found by clicking here or at http://lt.linear.com/00w.
To request a correction, reply or follow-up report on this article, see how to file a request. Previously published statements are collected in corrections & replies.
명세환 기자
명세환 Reporter

Comments