[Photo News] 1 Tera NAND Flash to Become a Reality in the Near Future
Published2016.08.12 09:28
Samsung Electronics President Kim Ki-nam received a Lifetime Achievement Award at the Flash Memory Summit held at the Santa Clara Convention Center in the United States on the 10th (local time).
The Flash Memory Summit is the world's largest flash memory industry conference held annually in the United States (August 8–11).
President Kim Ki-nam received this award in recognition of his leading role in advancing flash memory technology, as Samsung Electronics doubled its NAND flash capacity every year from 2Gb in 2002 to 32Gb in 2006. The FMS Lifetime Achievement Award is presented annually to an individual who has demonstrated outstanding leadership in the development of flash memory-related technologies and the expansion of the market.
In his acceptance speech, President Kim Ki-nam said, “Since I served as the head of Samsung Electronics’ Semiconductor Research Institute in 2003, I believed that innovative technology would be needed to overcome the limitations of planar NAND flash, and I have made continuous efforts to develop V-NAND despite various technical difficulties.” He added, “Following the world’s first mass production of 1st generation 24-layer V-NAND in August 2013, we plan to mass produce 64-layer V-NAND by the end of this year. I believe that 1Tb (terabit) NAND flash will become a reality in the near future, which means we will be able to stack more than 100 layers.”
관련뉴스
.jpg)
Samsung Electronics Globally Launches 'Premium Memory Card'
2015.05.21by 명세환 기자
Samsung Electronics to Mass-Produce 256GB UFS Internal Memory for Smartphones
삼성전자가 이달부터 차세대 스마트폰용 내장메모리 '256기가바이트 UFS(유에프에스, Universal Flash Storage)’를 세계 최초로 양산한다. ‘256기가바이트 UFS’는 고성능 마이크로SD 카드보다 9배 빠르고(연속읽기 속도 기준) 노트북용 보급형 SSD보다도 2배 가까이 빨라 메모리 스토리지 시장의 성장 패러다임을 용량 중심에서 성능 중심으로 한단계 레벨업시킬 것으로 기대되는 제품이다
2016.02.25by
Semiconductor equipment manufacturers' orders increase, reflecting 3D NAND and Chinese investments.
According to the April BB ratio report released by the Semiconductor Equipment and Materials International (SEMI), North American semiconductor equipment manufacturers' bookings (3-month average) for April 2016 were $1.59 billion, with a BB ratio of 1.10. The BB ratio is calculated by dividing bookings by billings, meaning a BB ratio of 1.10 indicates bookings of $110 per $100 of billings. April bookings of $1.59 billion increased 15.6% compared to March bookings of $1.38 billion, and rose 1.3% compared to April bookings of $1.57 billion in the previous year. April semiconductor equipment billings were $1.46 billion, up 21.5% from March billings of $1.20 billion, and down 4% from April billings of $1.52 billion in the previous year.
2016.05.26by 명세환 기자
EMC Korea Launches All-Flash Model Equipped with Latest 3D V-NAND
한국EMC(대표 김경진)가 하이퍼 컨버지드 인프라에도 올 플래시를 도입, ‘V엑스레일(VxRail)’의 올 플래시 버전을 출시했다. 최신 3D V낸드를 장착한 올 플래시 V엑스레일은 EMC의 진일보한 데이터 절감 기술을 이용해 기가바이트당 가격을 획기적으로 낮췄다. 올해 초 EMC가 VMware와 공동 발표한 V엑스레일은 일원화된 관리를 통해 IT 운영을 간소화하고 민첩성을 높이는 하이퍼 컨버지드 어플라이언스다. 가상화 SW와 서버, 스토리지, 데이터 보호 기능을 하나의 시스템에서 통합 제공하며 VMware에 최적화된 소프트웨어 정의 데이터센터(SDDC) 환경을 가장 쉽고 빠르고 구현한다.
2016.06.23by 명세환 기자
Intel Unveils Next-Generation 'Core Ultra Series 3' and vPro Platform for Enterprise PCs
인텔이 차세대 기업용 PC를 위한 ‘인텔 코어 Ultra 시리즈 3’와 최신 vPro 플랫폼을 공식 발표하며, 기업용 노트북부터 고성능 워크스테이션까지 폭넓은 수요 충족에 나섰다.
2026.03.26by 배종인 기자
