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It supports 3G, Wi-Fi, Bluetooth, and GNSS.
Launch of smart modules optimized for IoT cloud environments
Telit (CEO Derek Sang) announced that it has launched the industry's first hybrid IoT module that combines 3G cellular, Wi-Fi, Bluetooth, and GNSS into a single package.
The HE922-3GR and WE922-3GR smart module series, newly added to the xE922 family, are the first products to utilize the Intel® Atom™ x3 SoC processor, based on vast I/O resources and an independent quad-core processing engine.

This new product combines with Telit's IoT portal and IoT connectivity services to provide a complete end-to-end solution. It can be utilized in various fields such as healthcare, vending, POS, public parking lots, smart buildings, smart grids, and industrial IoT.
Kim Hee-cheol, Managing Director of Sales for Telit Korea, stated, “The xE922-3GR is an innovative product that will completely change the landscape of the market. The complexity arising from designing devices composed of multiple chipsets has a massive impact on cost and time-to-market. The all-in-one hybrid module offers a solution to these problems.” “Previously, developing IoT device prototypes using multiple chips required a skilled engineering team of several months, but with an all-in-one product, a high-quality end-to-end solution can be developed within weeks with just one or two engineers,” he explained.
Lee Kyung-jun, Senior Vice President of APAC Marketing at Telit, said, “Regardless of industry, companies are striving to accelerate development speeds for rapid product launches. Telit supports customers in connecting, integrating, and managing various ‘things’ based on mobile apps, enterprise systems, or the web by combining its cloud-ready IoT modules, customized data plans, IoT portals, and long-standing IoT expertise. Through collaboration with Telit, customers will be able to achieve business innovation in the fastest way possible and improve operational efficiency.”
Launch of smart modules optimized for IoT cloud environments
Telit (CEO Derek Sang) announced that it has launched the industry's first hybrid IoT module that combines 3G cellular, Wi-Fi, Bluetooth, and GNSS into a single package.
The HE922-3GR and WE922-3GR smart module series, newly added to the xE922 family, are the first products to utilize the Intel® Atom™ x3 SoC processor, based on vast I/O resources and an independent quad-core processing engine.
This new product combines with Telit's IoT portal and IoT connectivity services to provide a complete end-to-end solution. It can be utilized in various fields such as healthcare, vending, POS, public parking lots, smart buildings, smart grids, and industrial IoT.
Kim Hee-cheol, Managing Director of Sales for Telit Korea, stated, “The xE922-3GR is an innovative product that will completely change the landscape of the market. The complexity arising from designing devices composed of multiple chipsets has a massive impact on cost and time-to-market. The all-in-one hybrid module offers a solution to these problems.” “Previously, developing IoT device prototypes using multiple chips required a skilled engineering team of several months, but with an all-in-one product, a high-quality end-to-end solution can be developed within weeks with just one or two engineers,” he explained.
Lee Kyung-jun, Senior Vice President of APAC Marketing at Telit, said, “Regardless of industry, companies are striving to accelerate development speeds for rapid product launches. Telit supports customers in connecting, integrating, and managing various ‘things’ based on mobile apps, enterprise systems, or the web by combining its cloud-ready IoT modules, customized data plans, IoT portals, and long-standing IoT expertise. Through collaboration with Telit, customers will be able to achieve business innovation in the fastest way possible and improve operational efficiency.”
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