Integrated single-chip automatic power management, Bluetooth-compatible radio, and low-power sensor controller
Improving IoT Application Performance with Bluetooth Low Energy Solutions

Texas Instruments (TI) today introduced two scalable SimpleLink Bluetooth low energy wireless microcontrollers (MCUs) offering more memory, Bluetooth 5-capable hardware, automotive qualifications and a new ultra-small wafer-chip-scale package (WCSP) option.

This new device offers high integration, including a complete single-chip hardware and integrated software solution including an ARM Cortex-M3-based MCU, automatic power management, a Bluetooth-compatible radio, and a low-power sensor controller.

A new TI Bluetooth low energy solution adds more memory to the SimpleLink CC2640R2F wireless MCU to improve the performance of Internet of Things (IoT) applications.



The device is available in a 2.7x2.7mm WCSP option and offers long range at low power. It is suitable for implementing smartphone connectivity for car access such as passive entry passive start (PEPS) and remote keyless entry (RKE), as well as automotive applications with AEC-Q100 qualification and temperature grade 2. Additionally, the CC2640R2F-Q1 device is a solution that uses a wettable flank QFN package to reduce production line costs and improve reliability through optical inspection of solder points.

The scalable SimpleLink CC264x wireless MCU family enables product optimization based on size, system cost, and application requirements, rather than using a one-size-fits-all solution. Additionally, the CC264x family is supported by an integrated software and application development environment, royalty-free BLE-Stack software, the Code Composer Studio IDE, system software, and interactive training materials.