Provided as a set of Telemaco 3P-based central processing modules, boards, and plug-in modules

STMicroelectronics has launched a new Modular Telematics Platform (MTP).

It is an open development environment that supports the prototyping of advanced smart driving applications, such as backend servers, road infrastructure, and connectivity with other vehicles. It ensures development flexibility and scalability by integrating a diverse set of automotive connectivity devices, available as both board and plug-in modules, along with a central processing module based on the recently released automotive security telematics processor, Telemaco3P.

The new security telematics processor, Telemaco3P, is already being supplied to top OEMs and Tier 1 vendors worldwide, and the launch of the new MTP has enabled accelerated development of Telemaco3P applications.

The core of MTP is ST's Telemacor 3P device. This device is the first in the industry to incorporate a Hardware Security Module that provides state-of-the-art on-chip security features.

In addition, this MTP integrates ST's automotive-grade Multi-Constellation GNSS Teseo IC and Dead-Reckoning sensors, and Telemaco 3P's state-of-the-art automotive security module can further enhance security capabilities through the optional onboard ST33 Secure Element chip.

In addition, automotive buses such as CAN, FlexRay, and BroadR-Reach® (100Base-T1) can be directly connected to the board, and wireless networks can be accessed by selecting from Bluetooth™ Low Energy, Wi-Fi, and LTE modules. The MTP is designed for advanced automotive telematics applications, such as remote diagnostics and Firmware Over-The-Air (FOTA) updates for secure ECUs (Engine Control Units), and also includes expansion connectors for V2X and a precision positioning module.