Intel has launched the Intel Stratix 10 TX FPGA, the industry's only field programmable gate array (FPGA) with 58G PAM4 transceiver technology.

Intel Stratix 10 TX FPGAs, when integrated with 58G PAM4 technology, can double transceiver bandwidth performance compared to existing solutions. This bandwidth performance makes them an essential connectivity solution for next-generation use cases where high bandwidth is paramount, including optical transport networks, network functions virtualization (NFV), enterprise networking, cloud service providers, and 5G network applications.

To enable the future of networking, NFV, and optical transport solutions, Intel Stratix 10 TX FPGAs offer up to 144 transceiver lanes with serial data rates from 1 Gbps to 58 Gbps. This combination delivers higher aggregate bandwidth than any existing FPGA, enabling designers to scale to 100G, 200G, and 400G transmission speeds. Supporting dual-mode modulation, 58G PAM4, and 30G NRZ, new infrastructure can achieve 58G data rates while maintaining backward compatibility with existing network infrastructure. A wide range of intellectual property (IP) cores, including 100GE MAC and FEC, provide optimal performance, latency, and power.

“In today’s smart and connected world, billions of devices are generating massive amounts of data that require fast, flexible and scalable connectivity solutions,” said Reynette Au, vice president of marketing for Intel’s Programmable Solutions Group. “With Stratix 10 TX FPGAs, Intel continues to provide designers with faster transceiver bandwidth and robust, low-power IP that meet the incessant demand for faster, higher-density, low-power connectivity.”

The Intel Stratix 10 FPGA family launched by Intel includes the following products: Intel Stratix 10 GX FPGAs (with 28G transceivers), Intel Stratix 10 SX FPGAs (with embedded quad-core ARM processors), Intel Stratix 10 MX FPGAs (with HBM memory), and Stratix 10 TX FPGAs (with 58G transceivers). The Intel Stratix 10 FPGA family utilizes Intel's 14nm FinFET manufacturing process and integrates cutting-edge packaging technologies, including EMIB.