인피니언 테크놀로지스(코리아 대표이사 이승수)가 자동차 소프트웨어 개발을 위한 새로운 확장형 소프트웨어 포트폴리오인 ‘드라이브 코어(Drive Core)’를 출시하며, 자동차 소프트웨어 개발 과정을 단순화하고, 매끄러운 사용자 경험을 제공한다.
Provides integrated SW and tool bundles for immediate use from the early stages of development
Infineon Technologies (Korea CEO Seung-Soo Lee) presents a new standard to make automotive software development easier and contributes to the continuous development of the automotive industry.
Infineon has launched Drive Core, a new scalable software portfolio for automotive software development.
The solution supports major microcontroller platforms including AURIX™, TRAVEO™ and PSOC™, and provides users with a pre-integrated software and tool bundle that is ready for immediate use from the beginning of software development.
“Drive Core simplifies and accelerates software development and reduces commercial complexity,” said Patrick Will, Senior Director at Infineon. “We work with our partners to integrate the various components to deliver a seamless user experience.”
The AURIX™ Drive Core offers two main bundles that support high-performance computing. The AURIX™ Drive Core AI Bundle simplifies the model-based design process by including third-party tools such as MATLAB Simulink. At the same time, it provides an evaluation environment optimized for e-mobility and autonomous driving by utilizing the PPU (Parallel Processing Unit).
Additionally, the AURIX™ Drive Core AUTOSAR bundle facilitates the development of safety applications such as ADAS (Advanced Driver Assistance Systems) and zone controllers. Integration with the Tasking certified toolchain and the Vector MICROSAR Classic software stack supports reliable and efficient development.
The TRAVEO™ T2G Drive Core Graphics Bundle is designed to enhance the performance of cockpit applications. It provides advanced graphics capabilities, including the QT graphics stack and Hardware Abstraction Layer (HAL), and includes AUTOSAR support to accelerate development time.
The PSOC™ 4 HV drive core, bundled with Vector MICROSAR IO, provides a lightweight solution for compact mechatronic electronic control systems. The bundle maximizes cost efficiency in mission-critical applications such as battery management, parking sensors, and HVAC systems.