To build an intelligent semiconductor development ecosystem
1.0096 trillion won will be invested over 10 years.


A single entity has been launched to oversee the development of next-generation intelligent semiconductors for the next 10 years.

On the 10th, the Ministry of Science and ICT (hereinafter MSIT) and the Ministry of Trade, Industry and Energy (hereinafter MOTIE) held a launch ceremony for the 'Next Generation Intelligent Semiconductor Project Group' (hereinafter Project Group) at the Semiconductor Industry Association located in Seongnam, Gyeonggi-do, and signed a Memorandum of Understanding (MOU) for the development of next-generation intelligent semiconductors and the establishment of an ecosystem to support them.

The launch ceremony was attended by about 20 officials from major domestic semiconductor companies and institutions, including Minister of Science and ICT Choi Ki-young, Minister of Trade, Industry and Energy Sung Yun-mo, Head of the Next-Generation Intelligent Semiconductor Business Group Kim Hyung-joon, and SK Hynix Vice Chairman Park Sung-wook.

The project consortium serves as the central hub for the next-generation intelligent semiconductor technology development project (hereinafter referred to as the project), which is being launched this year by the Ministry of Science and ICT and the Ministry of Trade, Industry and Energy. It establishes a mid-to-long-term development roadmap encompassing all sectors of the semiconductor industry, coordinates with infrastructure institutions to support this, and acts as a bridge for public-private cooperation.

1.0096 trillion won will be invested in the project from 2020 to 2029, making it the only project exceeding 1 trillion won among R&D projects that have undergone preliminary feasibility studies in the last five years.

This year, 103 companies, 32 universities, and 12 research institutes are participating in 82 projects. In the future, the development of future devices to reduce power consumption and achieve high performance, advancement of design technology to improve computational speed, and the devising of atomic-level process and equipment technologies to overcome miniaturization limitations will be pursued.

Meanwhile, at the launch ceremony, side events included the signing of a cooperation MOU to enhance competitiveness in the semiconductor materials, components, and equipment sectors, as well as an MOU for solidarity and cooperation between major semiconductor companies and institutions.

Minister of Trade, Industry and Energy Sung Yun-mo stated, “To strengthen the overall competitiveness of the system semiconductor ecosystem, we will expand and reorganize the Convergence Alliance 2.0 to enhance solidarity and cooperation among design companies, foundries, and demand companies centered on AI semiconductors, and we will spare no comprehensive support to strengthen the competitiveness of the ecosystem, including the materials and equipment industries that will support this.”