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Infineon Announces 2nd Generation StrongIRFET Technology
Suitable for UPS, SMPS, motor drives, etc.
Packages other than TO-220 will be released later
Infineon announced on the 18th the launch of StrongIRFET™ 2, a next-generation 80V and 100V power MOSFET technology. Orders for the TO-220 package are currently available, and TO-220 FullPAK, D2PAK, D2PAK 7-pin, and DPAK package products are scheduled to be added in the future.

It is optimized for both low and high switching frequencies and offers high design flexibility due to its suitability for various applications. It is suitable for applications such as SMPS, motor drives, battery-powered tools, battery management, UPS, and light electric vehicles (LEVs).
StrongIRFET 2 technology improves overall system performance with higher power efficiency by improving RDS(on) by 40% and lowering Qg by more than 50% compared to the previous generation. The increased current rating enhances current delivery capability, eliminating the need to use multiple devices in parallel. This reduces BOM costs and saves board space.
Suitable for UPS, SMPS, motor drives, etc.
Packages other than TO-220 will be released later
Infineon announced on the 18th the launch of StrongIRFET™ 2, a next-generation 80V and 100V power MOSFET technology. Orders for the TO-220 package are currently available, and TO-220 FullPAK, D2PAK, D2PAK 7-pin, and DPAK package products are scheduled to be added in the future.
▲ Launch of 2nd Generation StrongIRFET Products [Photo = Infineon]
It is optimized for both low and high switching frequencies and offers high design flexibility due to its suitability for various applications. It is suitable for applications such as SMPS, motor drives, battery-powered tools, battery management, UPS, and light electric vehicles (LEVs).
StrongIRFET 2 technology improves overall system performance with higher power efficiency by improving RDS(on) by 40% and lowering Qg by more than 50% compared to the previous generation. The increased current rating enhances current delivery capability, eliminating the need to use multiple devices in parallel. This reduces BOM costs and saves board space.
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