TSMC is expected to begin 4nm production in the third quarter, marking the completion of preparations for full-scale mass production.

According to Taiwan's Digitimes, TSMC is reportedly planning to start risk production using the 4nm process, which will be the most advanced process, as planned in the third quarter of 2021, and will transition to mass production if no issues are found.

TSMC announced the trial production of its 4nm product, N4, at an online technology symposium in early June, and at the time, it was reported that development was progressing smoothly and that it would further improve performance, power efficiency, and transistor density in the 5nm product family, while providing close compatibility in design rules with N5 by reducing mask layers.

It was also reported that the 3nm process is also progressing smoothly in development, with mass production scheduled for the second half of 2022.

TSMC's 3nm technology, N3, is based on the FinFET transistor architecture and is expected to be faster, consume up to 30% less power than 5nm, and show up to 70% logic density advantages.