LPKF, a German laser processing specialist founded in 1976
Reduce the cost and time of demanding PCB prototyping.
We also provide cutting-edge DP and glass processing equipment for telecommunications products.


Products based on various materials are being produced to address issues surrounding the industry.

In July 2019, Japan's Ministry of Economy, Trade and Industry (METI) implemented export restrictions on materials related to semiconductor and display manufacturing to South Korea. Concerns that this could disrupt the production of key export products that drive the domestic economy led companies to diversify their material supply sources and develop domestically produced materials.

The Ministry of Science and ICT held a performance report meeting in July of this year to mark the second anniversary of the full-scale implementation of the materials, components, and equipment R&D support policy, and announced that 924.1 billion won was invested over the two years, resulting in technological achievements such as 2,171 SCI-level papers, 1,570 patent applications, and 466 patent registrations.

The COVID-19 pandemic, which began in early 2020, led to a surge in demand for electronics, while Tesla's rapid stock price rise and the trend toward reducing carbon emissions due to extreme weather events led to the electrification of the automotive industry. As new materials, components, and equipment continue to be developed, the manufacturing industry is struggling to create high-performance, high-precision, and ultra-small products using these new materials.

We met with Lee Yong-sang, CEO of LPKF Laser & Electronics Korea, to discuss manufacturing trends related to laser processing, the advantages and applications of in-house PCB prototyping equipment, and processing trends and outlook for glass and new materials.



Q. What kind of company is LPKF Laser & Electronics Korea?

A. LPKF is a high-tech laser company listed on the German stock exchange. LPKF Korea is the official Korean branch of LPKF's headquarters in Germany, a 100% foreign-owned subsidiary.

Founded in 2014, the company underwent a major restructuring in 2019 to strengthen its Korean business. Currently, the company is led by three experienced sales managers and two dedicated technical support and application engineers.



Q. What sets LPKF Laser & Electronics apart in the laser processing industry?

A. Founded in 1976, LPKF has focused exclusively on laser processing of various materials, accumulating deep expertise in this field. While we utilize products from established laser source companies, we also have a subsidiary that develops and manufactures laser sources, providing significant advantages in product development and after-sales support.



Q. What are the current issues facing the manufacturing industry?

A. Historically, the development of new technologies has required the use of new materials. Many electronic products are currently following the trend toward lighter, thinner, shorter, and smaller forms. Even the automotive industry, previously dominated by mechanical components, is rapidly becoming more electronic. Foldable mobile phones are also being developed, and displays are expected to follow suit. This is driving the need for changes in cover glass.

As product sizes shrink, PCB designs are becoming more complex and thinner to maximize space. Cutting these PCBs is limited by conventional mechanical routers. The electrification of vehicles demands significant changes. In particular, as autonomous driving becomes essential, efforts are being made to ensure the reliability of components. This is why the need for laser plastic welding is increasing.

I believe LPKF Korea is well-positioned to respond to these market changes.



Q. At the 'Nano Korea 2021' event, you showcased equipment for PCB prototyping, including the 'ProtoLaser.' What are the strengths of this equipment?

A. PCB prototyping may be unfamiliar to you. Currently, most PCBs are manufactured through outsourcing, even during the development phase, but this increases development costs and time. However, LPKF PCB prototyping equipment allows you to create and test circuits produced using 3D tools in a lab in just a few hours, reducing costs and time. This is particularly in demand in defense industries, where confidentiality is paramount.

LPKF PCB prototyping equipment is also being used in the development of next-generation communications materials and PCBs, including 5G and 6G. Next-generation communications products require higher precision and finer line widths than existing 3G and LTE products. Using in-house equipment such as LPKF protolasers during the R&D process for your product can save you money and time.

I don't limit the applications of our PCB prototyping equipment. Equipment like protolasers can be considered material processing equipment.

Recently, there has been a growing demand for PCBs based on new materials. Robotics and medical devices are prime examples. In fact, our equipment is being used to manufacture products based on entirely new materials, not traditional PCB materials.

TODOC, a domestic medical device startup, utilized our products in the development of artificial cochleas, creating an innovative product that far surpasses existing products.

It is currently undergoing KFDA approval and is expected to be fully commercialized soon. This type of equipment is in high demand in typical technology-driven countries. Major buyers include the United States, China, Japan, and European countries. Domestic adoption is also highly likely.



Q. With the recent increase in products touting wireless charging and flexible displays as their strengths, the electronics industry's interest in glass processing solutions is expected to grow.

A. Glass is arguably the most sought-after material in the manufacturing industry. Various forms of displays are emerging, and more are expected to emerge in the future.

LPKF has a patented technology called LIDE (Laser Induced Deep Etching) for glass processing. This technology solves the micro-cracks and aspect ratio issues associated with conventional etching and direct laser processing. Furthermore, it is suitable for mass production and is low-cost, making it suitable for use in a wide range of fields.

The electronics industry has traditionally relied heavily on glass, but it is expected to utilize it in entirely new ways in the future. Furthermore, because glass possesses excellent dielectric properties, it has great potential for use in next-generation high-frequency applications.

Recently, LPKF in Germany developed a glass PCB for next-generation autonomous vehicle Lidar, operating at frequencies from 100 GHz to 300 GHz, and has partnered with a related consortium to produce a prototype. Furthermore, efforts to utilize glass in the semiconductor industry are also on the rise. LPKF recently secured an 8 million euro order from a global semiconductor manufacturer.



Q. Are there any other solutions you would like to introduce specifically to the Korean market?

A. I'd like to introduce the "AMP (Active Mold Packaging) 3000" equipment, which applies Laser Direct Structuring (LDS) technology, the most widely used technology in the antenna field since the LTE era, to semiconductor packaging. This equipment can be used for semiconductor RDL, antenna-on-chip, EMI management, and thermal management.



Q. What are your future goals in the Korean market?

A. We aim to play a key role in the domestic industrial ecosystem in the PCB-related industries as well as in the electronics, display, semiconductor, automotive, and medical fields as a next-generation technology partner.