With the introduction of cutting-edge technology and next-generation products at the upcoming CES 2023, fierce off-site competition is unfolding even before the event begins, as flagship products and new lineups are being announced.

SK Hynix announced on the 27th that it will showcase a large number of flagship memory products and new lineups at 'CES 2023,' the world's largest electronics and IT exhibition held in Las Vegas, USA.

SK Hynix emphasized, “At this CES, we have decided to showcase a collection of products that have drastically reduced carbon emissions under the title ‘Green Digital Solution,’ in line with SK Group’s direction of a ‘carbon-free future.’ We expect the lineup to attract the attention of global big tech customers and experts, as it not only reduces environmental impact but also features significantly improved performance and efficiency compared to the previous generation.”

With the recent acceleration of growth in high-tech industries such as AI, big data, autonomous driving, and the metaverse, global technology companies are focusing on memory semiconductors that can rapidly process rapidly increasing data while improving energy efficiency. SK Hynix believes that its products to be showcased at CES have achieved excellent performance relative to power consumption that meets these market demands.

The flagship product to be showcased by SK Hynix is the ultra-high-performance enterprise SSD 'PS1010 E3.S (hereinafter PS1010)'. The PS1010 is a packaged product made by combining multiple SK Hynix 176-layer 4D NAND chips and supports the next-generation interface, PCIe Gen 5.

SK Hynix engineers explained, “As the server memory market continues to grow despite the downturn, we are unveiling a new product that embodies SK Hynix’s technological prowess, which possesses the industry’s highest competitiveness in this field.” In fact, the PS1010’s read and write speeds improved by up to 130% and 49%, respectively, compared to the previous generation. In addition, this product features a power efficiency improved by more than 75%, which is expected to lower customers' server operating costs and carbon emissions.

“We are proud to showcase SSD products capable of solving server customers’ pain points at CES, the world’s largest event,” said Yoon Jae-yeon, Vice President of SK Hynix. “We expect the competitiveness of the company’s NAND business to be further strengthened based on ultra-high-performance products equipped with our own developed controller and firmware.”

In addition, at this exhibition, SK Hynix is showcasing next-generation memory products suitable for High Performance Computing (HPC) environments, including 'HBM3,' the highest-performing DRAM currently available; 'GDDR6-AiM,' which features PIM technology that adds computational capabilities to memory; and 'CXL Memory,' which allows for flexible expansion of memory capacity and performance.

Meanwhile, at the SK Hynix CES booth, the 'Immersion Cooling' technology of SK N-Move, an energy efficiency company within the SK Group, is also being exhibited. This is a next-generation technology that lowers the operating temperature of servers housing semiconductors, and SK Hynix plans to continue expanding collaboration with group members as well as external partners to strive for the creation of new added value across the entire semiconductor business.