ON Semiconductor, a leader in intelligent power and sensing technologies, is embarking on the development of next-generation innovative technologies for automotive and power conversion systems in Europe.

Onsemi announced on the 21st that it has opened an electric vehicle system application test lab in Piestany, Slovakia.

The Advanced Systems Applications Lab focuses on advancing system solutions for batteries, plug-in hybrids, electric vehicles (xEVs), and energy infrastructure (EI) power conversion systems.

We also work with automotive OEMs, Tier 1s, and EI suppliers to provide specialized equipment to develop and test next-generation silicon (Si) and silicon carbide (SiC) semiconductor solutions.

State-of-the-art semiconductor devices are essential for high-efficiency power conversion in electric vehicle powertrains and charging, as well as renewable energy applications. This research center will play a key role in developing future power products, providing highly differentiated, value-added solutions tailored to customers' specific needs.

The new lab consists of two high-voltage power labs, focusing on system- and device-level development as well as SiC/Si traction inverters and ACDC/DCDC power converters. Laser welding facilities, mechanical cleanrooms and workshops enable rapid prototyping and testing of next-generation system solutions.

Evaluation capabilities for next-generation system solutions include: △ 24/7 continuous testing △ Internally developed and patented software and hardware solutions to support high-voltage power cycling through space vector modulation (SVM) and sinusoidal pulse width modulation (SPWM) △ High-precision logging devices for health and reliability assessment of SiC and Si △ Testing of liquid-cooled devices at temperatures as low as -50°C and up to 220°C, simulating the harsh conditions inverters face during operation △ In addition to field programming of FPGAs and ARM microcontrollers, a wide range of industry-recognized software enables qualification testing, data analysis and 3D modeling.