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Texas Instruments (TI) held 'TI Embedded Labs 2025' at the Westin Seoul Parnas on the 20th, unveiling its innovative technologies and product portfolio in the embedded systems field and focusing on how TI is responding to the latest trends such as SDV, AI, radar, and wireless connectivity.

In his keynote speech, Park Joong-seo, CEO of TI Korea, stated that the company is actively expanding its internal capacity to ensure a smooth supply chain by developing technologies that meet market needs and expanding its production facilities worldwide.

CEO Park Joong-seo said, “Since its founding in 1930, TI has established itself as a global leader in the semiconductor and integrated circuit (IC) fields, and has achieved significant technological achievements such as the invention of the first IC in 1958 and the development of the world’s first MCU in 1971.”

He continued, “TI’s core philosophy is ‘Accessible Innovation’.He said, “We introduced radar technology, which was expensive, large, and heavy in the past, into the market in a small package and at a reasonable price in 2017, providing practical benefits to both industry and consumers.”

“In particular, the recently released MCU is optimized for size and weight-sensitive products such as wireless earbuds, wearables, and medical devices with an ultra-small size of 1.6×6.8mm,” he said. “TI is responding quickly to market needs with a new core (C29) that maximizes performance and power efficiency, and an MCU equipped with AI functions combined with a real-time OS.”

The internalization of AI technology is also noticeable.

CEO Park Joong-seo said, “TI has already applied generative AI functions to voice synthesis toys in 1978, and recently, it has been leading innovation in the fields of safety and security, such as Arc Fault Detection, by combining hardware AI (HAR AI) and real-time OS in MCUs.” He added, “While the latency of existing Arc Fault Detection reached 400ms, TI’s latest MCU reduces it to 4ms and has an accuracy of 99%. “This is creating a huge stir in the market by significantly increasing the safety of energy storage systems such as ESS,” he said.

TI's product portfolio ranges from general-purpose MCUs to high-end processors, wireless connectivity, and radar sensors.

It supports the latest wireless technologies such as BLE, Wi-Fi 6, and BT 6.0, and is applied in various fields such as automotive, industrial, factory automation, and disaster prevention.

In particular, BT 6.0 offers new features such as precise measurement of location information and reduced latency, and TI is responding quickly in the global market.

TI also supports developers in designing systems quickly and easily through open-source software and collaboration with various partners.

TI's strength lies in providing 'portable solutions' that take into account not only hardware but also software accessibility, reasonable price, and performance implementation.

We also thoroughly support functional safety and cybersecurity, enhancing the reliability and safety of embedded systems.

Supply chain stability is also one of TI's important strategies.

CEO Park Joong-seo said, “With the importance of the supply chain highlighted in the wake of the COVID-19 pandemic, TI is pursuing a plan to produce 95% of all products in-house by 2030,” adding, “By internalizing both the front-end and back-end processes, we are preparing to stably supply products in the quantities customers want, when they want them.”

He also mentioned, “We are securing both price competitiveness and quality by supporting MCUs, processors, and radar products from 28nm to 90nm processes, as well as high-performance AI products down to 4nm processes.”

“TI plans to continue to meet the diverse needs of our customers with more products, innovations, and expanded production capabilities,” said CEO Park Joong-seo. “We will lead trends and technological advancements in the embedded systems market and realize innovations that are accessible anytime, anywhere.”