SK Telecom announced that it signed a three-party memorandum of understanding (MOU) with Supermicro and Schneider Electric at MWC26 to advance the construction of AI data centers (AI DCs) and to secure an integrated solution based on 'pre-fabricated modular'.

The announcement was made public at 8:00 AM KST on March 4th (0:00 AM in Barcelona on March 4th). SKT explained that the agreement was signed at the MWC26 event held in Barcelona.

Prefab modularization involves prefabricating power, cooling, and IT infrastructure in modules and then assembling them on-site. SKT differentiates this approach from the traditional method of sequentially building servers after a building is completed by integrating the AI computing server and its supporting power and cooling infrastructure into a single module. The company also stated that this approach can be expanded by gradually adding modules as needed.

The three companies will divide their roles and concretize the integrated model. Supermicro supports modular configurations based on its GPU servers used for AI learning and inference and its cluster configuration capabilities, while Schneider Electric is proposing an infrastructure model that considers operational efficiency from the design stage through to the MEP (Mechanical, Electrical, Plumbing) perspective. SKT announced that it will cooperate based on its experience in operating AI DC projects.

Ha Min-yong, head of SKT's AI DC business, said, "We have been able to pursue an integrated solution using a prefab modular method through collaboration with global partners representing the AI DC field."