[Interview] Lee Jun-ho, Director at Monolithic Power Systems (MPS), "Stable Power Solutions Support Essential for SDV Transition"

2026.08.10by 배종인 기자

"Beyond the Era of Knowing Technology to the Era of Proving Technology"…e4ds Tech Day 2026 Concludes Successfully

e4ds' 'e4ds Tech Day 2026' held on September 8th at the Korea Science and Technology Hall concluded successfully. This event, centered on SDV and edge AI, focused on presenting practical application standards and utilization directions in actual industrial settings rather than on technology itself. CEO Myung Se-hwan emphasized the 'era of proving technology' and presented the importance of practical decision-making criteria, while Director Gwak Su-jin of the Korea Automobile Research Institute outlined the future mobility ecosystem based on AIDV and Physical AI. Subsequently, Shin Dong-joo, CEO of Mobilint, explained the role of edge AI semiconductors as core infrastructure in the Physical AI era. At the end of the event, the TechDay Contest 2026 awards ceremony and winning project presentations were held, sharing actual technology implementation cases and presenting a vision for building a collective intelligence ecosystem in the industrial field. The awards in this ceremony were presented respectively by Mouser Electronics and STMicroelectronics, both platinum sponsors of e4ds Tech Day 2026. Daphne Tien, Vice President of Mouser, and Matteo Marabita, Center Director of STMicroelectronics APAC AI Competence Center, presented awards directly to the winners.

2026.09.09by 배종인 기자

Facing High-Current Power Supply Design Limits, 'GaN Integration' Solution Rapidly Emerging

GaN-based integrated power conversion technology is emerging as a key solution, replacing silicon limitations in high-current environments such as AI servers, data centers, and robots. Texas Instruments' LMG708B0 and LMG5126 deliver equivalent efficiency even in areas reduced by up to 50%, and with low on-resistance and parasitic charge, they reduce switching losses and enable high-frequency operation. Through multiphase architecture, multichip module integration, and flip-chip-based thermal management, they solve EMI, heat generation, and power density issues, establishing themselves as core technologies in next-generation AI infrastructure power supply design.

2026.09.15by 배종인 기자

ST launches VD56GA 1.1MP image sensor for in-vehicle cabin sensing

STMicroelectronics has launched the VD56GA, a 1.1MP image sensor for in-vehicle cabin monitoring. This infrared-based sensor improves clarity by 35% and infrared sensitivity by 60% compared to the previous generation, while enabling overall camera module cost reduction through the use of low-cost optical components. It supports expanded deployment of driver and occupant monitoring systems (DMS/OMS) and features a compact CSP package with embedded image processing capabilities.

2026.09.15by 배종인 기자

Continental, 'EcoContact 7' Adopted as OE Tire for Volkswagen 'ID. Polo'

Continental Tire's EcoContact 7 has been officially adopted as the original equipment tire for Volkswagen's new all-electric compact car, the ID. Polo. It achieved the highest grade A in both energy efficiency and wet braking performance on the EU tire label, and by applying advanced technologies including rolling resistance reduction technology, aerodimples, and silent pattern, it ensures driving efficiency and quietness essential for electric vehicles. Domestic availability is scheduled for September.

2026.09.15by 명세환 기자