onsemi Projects $213 Billion Power Technology TAM by 2030...Expanding into Physical AI
Published2026.09.21 11:30
Chairman and CEO Hassane El-Khoury stated, "As AI, electrification, and automation expand, power density has emerged as one of the critical engineering challenges that will determine the next decade. Companies capable of delivering more energy in smaller spaces will lead innovation."
Accordingly, the company is pursuing a platform-based model that applies high-voltage technologies for automotive electrification across industrial energy systems and AI data centers.
The company anticipates this will enhance R&D investment efficiency and reduce dependence on specific markets or technology cycles.
△The high-voltage portfolio encompasses silicon, silicon carbide (SiC), and gallium nitride (GaN), addressing efficiency, switching performance, and size requirements for next-generation high-voltage applications through vertical GaN (vGaN) technology.
△The Treo platform combines highly integrated digital and high-voltage technologies to enhance real-time monitoring, communication, and load management capabilities within systems.
△EPP leverages the silicon wafer itself as a package, integrating heterogeneous technologies such as SiC and GaN into a wafer-scale architecture, and embeds FETs, drivers, and controllers in a single package to simultaneously optimize electrical, thermal, and mechanical performance.
The company plans to apply power, sensing, control, and connected computing technologies accumulated from automotive and industrial applications to the Physical AI market, and provide solutions that optimize overall stack performance through system-level co-design.
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