Launch of New, Highly Cost-Effective 50mm Thyristor/Diode Module

Infineon Technologies (Korea CEO Seung-soo Lee) announced that it is adding a new 50mm module to its family of thyristor/diode modules using solder bond technology.

These bipolar modules provide a highly cost-effective solution required even in demanding applications. The company explained that the solder bond modules are suitable for applications such as drives, power supplies, and welding equipment that do not necessarily require the high robustness of pressure contact technology, and are up to 25 percent cheaper than competing pressure contact solutions.

With the addition of new 50mm modules, Infineon has further expanded its existing bipolar module portfolio. These modules offer current ratings ranging from 280A to 330A. The 20mm and 34mm products have been in production for over two years and have proven their reliability in the field. These modules provide an optimized price-performance alternative to pressure contact technology. They are also constructed with industry-standard housings using electrically insulated base plates.

50mm modules using solder bond technology are currently being supplied in mass production along with 20mm and 34mm module products. All module products are available in thyristor/thyristor, thyristor/diode, and diode/diode topologies, with a blocking voltage of 1600V and current ratings ranging from 55A to 330A.

Infineon plans to add modules with blocking voltages of 1800V and 2200V in 2017.