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Applied Materials Invests Billions of Dollars in R&D Platform in Silicon Valley
▲Applied Materials EPIC Center
EPIC Center, World's Largest Scale Process Technology and Manufacturing Equipment R&D Collaboration Facility
Dedicated Space in R&D Fab Available, Early Access to Next-Generation Processes and Equipment
Dedicated Space in R&D Fab Available, Early Access to Next-Generation Processes and Equipment
Applied Materials is investing billions of dollars in an R&D platform that enables early access to next-generation processes and equipment for semiconductor innovation.
Applied Materials announced on the 22nd a groundbreaking investment in constructing the world's largest advanced semiconductor process technology and manufacturing equipment research and development (R&D) collaboration facility.
The new EPIC (Equipment and Process Innovation and Commercialization) Center is the heart of a rapid innovation platform designed to accelerate the development and commercialization of foundational technologies needed by the global semiconductor and computing industry.
Located on the Silicon Valley Applied Campus, this multibillion-dollar facility provides industry-leading capabilities and scale including over 180,000 square feet (equivalent to three American football fields) of state-of-the-art cleanrooms for collaborative innovation with chip manufacturers, universities, and ecosystem partners.
Designed to accelerate the pace of adopting new manufacturing innovations, the EPIC Center is expected to enable the industry to shorten the time required for technology to go from concept to commercialization by several years, while raising the commercial success rate of new innovations and the return on research and development investments across the entire semiconductor ecosystem.
Gary Dickerson, Chairman and CEO of Applied Materials, stated, "While semiconductors are more important to the global economy than ever, the technical challenges facing the industry are becoming more complex. This investment represents a golden opportunity to redesign how the global industry collaborates to provide the foundational semiconductor processes and manufacturing technologies needed to continue rapid improvements in energy efficiency and high-performance computing."
Applied's new EPIC Center is designed as the premier platform for leading logic and memory chip manufacturers to collaborate with the equipment ecosystem. For the first time, chip manufacturers can secure dedicated space within equipment suppliers' facilities to expand their internal pilot lines and gain early access to next-generation technologies and tools. This is possible months or even years before equivalent capabilities are installed at the chip manufacturers' own facilities.
The EPIC Center is expected to serve as a catalyst for accelerating the commercialization of academic research and strengthening the future semiconductor industry talent pipeline.
Universities have unparalleled capabilities in conceiving new concepts, but lack access to cutting-edge industrial laboratories and hardware, making it difficult to convert ideas into commercial reality. Applied's new platform provides university researchers access to the full range of industry-scale capabilities to validate their ideas, increasing innovation success rates and reducing the time and cost to commercialize new technologies.
Applied Materials will progressively invest a total of 4 billion dollars over the next seven years for establishing the EPIC Center. Completion is expected in early 2026, and it is anticipated to serve as a connection point for over 25 billion dollars in company R&D investments during the first 10 years of operation. The new center will employ up to 1,500 construction workers during the construction period in Silicon Valley and create up to 2,000 new engineering jobs, while potentially generating an additional 11,000 jobs in other industrial sectors. The EPIC Center is designed to potentially link with future U.S. National Semiconductor Technology Centers. Applied's investment scale may vary depending on U.S. government support through the Chips and Science Act provisions.
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