Reducing '650V Over-Design'…400V SiC Targets Power Semiconductor Niche Market
Published2026.08.10 13:21Infineon's second-generation 400V and 440V class CoolSiC MOSFET reduces the 'over-design' that occurred when using existing 500-650V devices, enabling a light-fit design matched to actual required voltage. Optimization of cell pitch, channel, and drift region improved switching loss and conduction performance, with reduced on-resistance temperature dependency. Particularly in 3-level flying capacitor topology, efficiency improvement and inductor miniaturization effects are significant, with high efficiency demonstrated in PFC and buck converter testing. However, 3-level circuits require capacitor balancing and additional control and protection design, making the efficiency and power density advantages relative to overall cost the key to market expansion.
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A single misaligned light means 'defect'… Vehicle interior lighting now guarded by semiconductors and software
Automotive interior lighting is moving beyond its role as 'auxiliary lighting.' As it becomes a core element of user experience (UX) that expresses brand identity through color and animation while reflecting driver preferences, the LED interior ambient lighting market is growing rapidly. In connection with this, we met in advance with Choi Young-jae, Research Director at Dabo Corporation, who will present a technical webinar session on "Intelligent LED Interior Lighting Solutions Illuminating Future Vehicles," to hear about market trends and changes in design requirements.
2026.08.28by 명세환 기자
Sang-Mo Yu, Dell President: "AI Is Now Infrastructure—Integrated Approach to Security, Power, and Data Centers Is Essential"
At Dell Technologies Forum 2026, Sang-Mo Yu, President of Dell Technologies Korea, emphasized that AI has transcended the role of a productivity tool to become core infrastructure for enterprises and everyday life, underscoring the necessity of a hybrid AI infrastructure strategy integrating power, cooling, security, and data centers. He disclosed that he utilizes more than 20 AI agents daily and identified embedded security and the absence of unified roadmaps as major challenges for enterprises.
2026.08.28by 배종인 기자
TI Unveils Multi-Axis Coreless Current Sensor TMCS2100-Q1 for HEV/EV Traction Inverters
Texas Instruments has unveiled the TMCS2100-Q1, a multi-axis coreless Hall-effect current sensor for HEV and EV traction inverters. By simultaneously measuring horizontal and vertical magnetic fields through multi-axis sensing technology, it achieves up to 20 times higher accuracy compared to conventional single-axis sensors, while the busbar-unmodified design provides mechanical design flexibility. It simultaneously meets the high-accuracy requirements and miniaturization driven by the expansion of 800V architectures.
2026.08.27by 배종인 기자
Keysight Technologies Launches Electronic Design Verification Solution 'Keysight Multiphysics'
Keysight Technologies has launched 'Keysight Multiphysics', a design verification solution that analyzes interactions between multiple physical elements such as electrical, thermal, and mechanical factors. The solution detects design defects early before prototype manufacturing and processes analysis that previously took weeks of orders in just a few hours. It features built-in support for MIL-STD, IEC, and JEDEC standards, and enables drop, shock, and vibration simulations without CAE experts, thereby reducing redesign costs and development schedules.
2026.08.27by 배종인 기자
Schneider Electric announces 'Impact 2030' first-half results
Schneider Electric has disclosed the first-half 2026 performance of its decarbonization roadmap 'Impact 2030' for 2030. The company has reduced Scope 1 and 2 emissions by 82% compared to 2017, and has cumulatively avoided and reduced carbon emissions of 913 million tons through customer solutions. The company is expanding AI-based support for 1,500 suppliers through the supply chain decarbonization program 'Zero Carbon Pathway'.
2026.08.27by 명세환 기자
