Revealed through Samsung Foundry Forum
Announcing a comprehensive process roadmap and FD-SOI solutions

Samsung Electronics held the 'Samsung Foundry Forum' in Santa Clara, USA.

At this forum, Samsung Electronics announced its cutting-edge foundry processes, including a wide range of advanced microprocess roadmaps from 8nm to 4nm and FD-SOI (Fully Depleted-Silicon on Insulator) solutions, with approximately 400 people from foundry (semiconductor contract manufacturing) customers and partners in attendance.

Samsung Electronics has been holding the 'Samsung Foundry Forum' in Korea, the United States, and China since last year, and plans to hold it again this year in Korea and overseas, starting with the US forum.

Samsung Electronics explained that the innovative process technologies, including the new cutting-edge microprocesses (8/7/6/5/4 nanometers) and 18 nanometer FD-SOI, unveiled at this forum will be the optimal solution to these changing industrial trends.

“In the ‘hyper-connected era’ where all devices are connected, the role of semiconductors is also growing,” said Jong-sik Yoon, Vice President of the Foundry Business Division. “As a foundry partner with a broad, advanced process roadmap, Samsung Electronics will actively build cooperative relationships with customers to provide optimal, customized solutions.”