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[Semiconductor Show 2022] Strengthening the Semiconductor Ecosystem… 235 Companies and 800 Booths Participating

Google 우선 소스Published2022.10.05 17:37

▲24th Semiconductor Expo
The largest number of participants include SK Hynix, Samsung Electronics, and other small and medium-sized enterprises (SMEs) and fabless companies.
Semiconductor Exhibition Keynote Speech, Market Outlook Seminar, and Other Side Events

As the semiconductor industry undergoes significant changes, the responsiveness of related companies is becoming increasingly crucial. At the largest-ever Semiconductor Expo, which featured participation from domestic and international semiconductor companies, inter-company cooperation and strengthening the semiconductor ecosystem emerged as key keywords.

The 24th Semiconductor Expo (SEDEX 2022) took place on the 5th at COEX in Samseong-dong, Seoul. Hosted by the Korea Semiconductor Industry Association, this comprehensive exhibition showcases future-leading technologies and products in semiconductors and related fields. It is Korea's leading semiconductor exhibition, sharing the latest information on the global semiconductor market and technology.

The Semiconductor Showcase saw the largest participation ever, with 235 companies and 800 booths. This demonstrated that the semiconductor industry is at a turning point and companies are more actively working to strengthen the semiconductor ecosystem and collaborate than ever before.

On this day, companies from various semiconductor upstream and downstream industries, such as memory semiconductors, system semiconductors, materials, parts, and equipment, facilities, and sensors, gathered at the exhibition hall.

Samsung Electronics showcased its diverse semiconductor solutions and portfolio, including memory, system LSI, foundry, and NAND flash. The Samsung SSD collection showcases the waterproof and dustproof T7 product, along with the '990 PRO' SSD, which is implemented with the latest V-NAND technology.
SK Hynix designed a space with a cybernetic concept, emphasizing keywords such as AI, big data, autonomous driving, and metaverse. △Disclosed its semiconductor technology portfolio including CMOS image sensors, UFS, HBM, PIM, and CXL.

▲SK Hynix booth

In the other component sector, Rohm Semiconductor showcased its SiC power device solution, and in the equipment sector, Wonik IPS, Korea Tektronix, PSK, Shinsung E&G, and Rittal participated and unveiled various equipment portfolios.

In the parts sector, Comico presented semiconductor parts cleaning and special coating solutions, while in the materials sector, Dongjin Semichem attracted attention with its photoresist and anti-reflection films for semiconductor manufacturing.

▲Semi Five Booth

In the design sector, SemiFive, a rising domestic fabless company, showcased its technological prowess through its SoC design platform portfolio, introducing SoC platforms in the HPC, AI, and AIoT sectors. Additionally, design solutions were showcased by Koasia, AD Technology, and Aegic Land.

We also provided opportunities to share semiconductor technology, trends, and prospects through various side events. Various events are planned, including a semiconductor keynote, a Swedish semiconductor technology seminar, a semiconductor market outlook seminar, a semiconductor industry-academia-research exchange workshop, the Korea Semiconductor Design Competition awards ceremony, and a future semiconductor industry recruitment briefing.

▲Kwak No-jeong, CEO of SK Hynix

At the Semiconductor Expo keynote, held under the theme of “A New Future Opened by Semiconductors,” Kwak No-jeong, CEO of SK Hynix and Chairman of the Korea Semiconductor Industry Association, appeared as a speaker.

CEO Kwak No-jeong stated, “The semiconductor industry is currently facing difficult times due to supply chain issues and geopolitical crises,” and added, “We have plans for a higher level of mutually beneficial cooperation after the Yongin cluster is launched, including preparations for cooperation with small and medium-sized enterprises.”

Kim Hyung-jun, head of the Next Generation Intelligent Semiconductor Business Unit, said, “In the OSAT sector, we need to make efforts to localize post-processing and small parts and equipment to achieve the goal of having three domestic OSAT companies ranked in the top 10 globally by 2030,” and emphasized, “The training of packaging experts must be supported.”
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