The critical keyword in the AI era is large-scale data processing. From next-generation HBM4 onwards, we are preparing for changes through hybrid bonding. In the rapidly transforming semiconductor market of the AI era, the gap is widening between the advancement curve of memory performance and the advancement curve of AI model size and required performance. Lee Kang-wook, Vice President of SK Hynix, discussed visions to solidify next-generation HBM leadership in response to these era-defining challenges.