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Henkel to Unveil Advanced Packaging Materials for AI and HBM at SEDEX 2026

Preferred source on GooglePublished2026.10.06 10:23

Introducing Solutions for High-Density Package Thermal Management and Reliability with Underfill, Molding, and TIM
 
As the semiconductor packaging technology enters the AI and HBM era, Henkel is disclosing advanced packaging material technologies at South Korea's largest semiconductor exhibition. A comprehensive lineup of material portfolios addressing challenges raised during high-density package design processes—including thermal management, stress control, package warpage, and reliability assurance—is expected to be showcased in one place.
 
Henkel's Adhesive Technologies division announced on the 6th that it will participate in 'SEDEX 2026 (28th Semiconductor Expo)' being held from the 14th to 16th at Seoul COEX Halls C and D.

The exhibition theme is 'Advanced Packaging for AI,' and material technologies required for high bandwidth memory (HBM) and high-performance computing (HPC) environments will be introduced at booth D277.
 
As AI and HPC computational demand increases, adoption of 2.5D and 3D packaging, chiplets, and heterogeneous integration technologies is accelerating.

Consequently, complex technical challenges such as high thermal density, mechanical stress, package warpage, and mass production process stability are becoming more prominent, and the role of materials in solving these issues is expanding.

Henkel will showcase △underfill △encapsulation and molding materials △lid and stiffener adhesive materials △thermal interface materials (TIM) at this exhibition.

Underfill protects fine interconnects from thermal and mechanical stress, while molding materials protect large-area and thin die while controlling package warpage.

TIM dissipates heat generated in high-density packages to support performance stability.

Henkel stated that in addition to material supply, it is collaborating through a co-engineering approach in which customer design and process challenges are jointly reviewed.

The company provides step-by-step technical support from material evaluation and verification through mass production application, and handles domestic customer support by linking its Songdo electronic materials production base with its global research and development network.

Lee Hyung-hee, Executive Director of Electronic Materials Business at Henkel Korea, stated, "In the AI and HBM era, the importance of material technology for thermal management, stress control, and long-term reliability assurance in high-density packages is becoming increasingly critical," adding, "We look forward to discussing advanced packaging technologies of the future with Korean customers and partners at this SEDEX."

Exhibition visits and meeting requests are available through Henkel's official website.
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