GaN-based integrated power conversion technology is emerging as a key solution, replacing silicon limitations in high-current environments such as AI servers, data centers, and robots. Texas Instruments' LMG708B0 and LMG5126 deliver equivalent efficiency even in areas reduced by up to 50%, and with low on-resistance and parasitic charge, they reduce switching losses and enable high-frequency operation. Through multiphase architecture, multichip module integration, and flip-chip-based thermal management, they solve EMI, heat generation, and power density issues, establishing themselves as core technologies in next-generation AI infrastructure power supply design.